In this episode, we continue our conversation from last episode with  Dave Wilcox, PCB CAM engineer at CircuitHub, to explore the intricacies of plugging and filling vias.

Topics Covered:

• The differences between plugging and filling vias, and when to use each method.
• The common challenges faced during the reflow process, including the infamous "popcorn effect" caused by trapped flux.
• Practical advice on preventing manufacturing issues related to via plugging.
• Cost considerations between tenting, plugging, and filling vias.
• Insights into using various materials for via filling, including epoxy and solder.
• A fascinating case study on using solder to plug vias for gas sensors.
• The importance of thoughtful PCB design and silkscreen placement to avoid manufacturing headaches.

Key Takeaways:

• Plugging vias can prevent air and flux entrapment, but must be carefully specified in the design.
• There’s a delicate balance between cost and functionality when choosing how to handle vias.
• Thoughtful design and clear communication with manufacturers can lead to smoother production and better results.

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